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<b>Chapter 1 Overview of flexible electronic encapsulating technology</b><br /> <br /> 1.1 Flexible electronics overview<br /> <br /> 1.2 Development of flexible electronic encapsulating technology<br /> <br /> 1.3 A brief introduction to the encapsulating technology of several important flexible electronic devices<br /><br /> 1.4 Flexible electronic encapsulating materials<br /><br /> 1.5 Overview of the development of flexible electronic packaging at home and abroad<br /><br /> <b>Chapter 2 Basic concepts related to flexible electronic packaging<br /></b><br /> 2.1 Composition of flexible electronic packaging<br /><br /> 2.2 Flexible electronic packaging structure <br /><br /> 2.3 Packaging Principle <br /><br /> 2.4 Encapsulation Technology <br /><br /> 2.5 Package stability<br /> <br /> 2.6 Encapsulated Products<br /><br /> 2.7 Summary of this chapter<br /><br /> <b>Chapter 3 Flexible substrates</b><br /><br /> 3.1 Concept and connotation of flexible substrates<br /><br /> 3.2 Development history of flexible substrates<br /><br /> 3.3 Flexible substrate materials<br /><br /> 3.4 Molding technology of flexible substrate<br /><br /> 3.5 Performance evaluation of flexible substrates<br /><br /> 3.6 Application of flexible substrates<br /><br /> 3.7 Development trend of flexible substrates<br /><br /> Bibliography<br /><br /> <b>Chapter 4 Test Methods</b><br /><br /> 4.1 Sealing test<br /><br /> 4.2 Bending test<br /><br /> 4.3 Mechanical performance testing<br /><br /> 4.4 Stability testing<br /> <br /><b> Chapter 5 Flexible electronic encapsulation</b><br /><br /> 5.1 Inorganic encapsulating material<br /><br /> 5.2 Organic encapsulating material<br /><br /> 5.3 Organic-inorganic hybrid encapsulating material<br /><br /><b> Chapter 6 Flexible Electronics Packaging Technology Development</b><br /><br /> 6.1 Flexible Electronics Packaging<br /><br /> 6.2 Thin Film Packaging Technology<br /><br /> <b>Chapter 7 Application of Flexible Electronics Packaging</b><br /><br /> 7.1 Industry chain analysis of flexible electronics packaging<br /><br /> 7.2 Packaging applications of flexible OLED devices<br /><br /> 7.3 Packaging applications for flexible solar cells<br /><br /> 7.4 Packaging applications for flexible electronic devices<br /><br /> 7.5 Packaging applications for flexible electronics sensors<br /><br /> <b>Chapter 8 Testing standards</b><br /><br /> 8.1 Terminology and alphabetic symbols<br /><br /> 8.2 Mechanical test method (deformation test)<br /><br /> 8.3 Environmental test methods<br /><br /> 8.4 Mechanical test methods (impact and hardness tests)<br /><br /><b> Chapter 9 Analysis of flexible electronic packaging enterprise</b><br /> <br /> 9.1 Flexible electronic packaging enterprise<br /><br /> 9.2 Analysis of flexible electronic packaging enterprises<br /><br /> <b>Chapter 10 Flexible Electronics Packaging Development Trends</b><br /><br /> 10.1 Flexible electronics packaging trends overview<br /><br /> 10.2 Introduction of three packaging technologies for flexible electronic devices<br /><br /> 10.3 Flexible electronics packaging development trend summary<br />

<p><i><b>Hong Meng, PhD, </b>is Professor in the School of Advanced Materials at Peking University Shenzhen Graduate School, China. He has been working in the field of organic electronics for more than 30 years, including working at the Instute of Materials Science and Engineering (IMRE) in Singapore, Lucent Technologies Bell Labs, and DuPont Experimental Station. </i> <p><i><b>Wei Huang, PhD, </b>is Professor at Frontiers Science Center for Flexible Electronics, Institute of Flexible Electronics, Northwestern Polytechnical University, China. He is Academician of Chinese Academy of Sciences, Russian Academy of Sciences, International Member of the National Academy of Engineering of USA, Academy of Engineering and Technology, Asian Pacific Academy of Materials, and Pakistan Academy of Sciences. He is an eminent scientist in the area of organic optoelectronics and flexible electronics.</i>

<p> <b>A systematic introduction to the future of electronic packaging</b> <p>Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. <p><i>Flexible Electronic Packaging and Encapsulation Technology </i>meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. <p><i>Flexible Electronic Packaging and Encapsulation Technology </i>readers will also find: <ul><li>Survey of commercial electronic packaging materials and patents for reference purposes</li><li>Guidelines for designing high-performance packaging materials with novel structures</li><li>An authorial team of leading researchers in the field</li></ul> <p><i>Flexible Electronic Packaging and Encapsulation Technology </i>is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

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